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IEICE Trans

Keyword : TSV redundancy

A Region-Based Through-Silicon via Repair Method for Clustered Faults
Tianming NI Huaguo LIANG Mu NIE Xiumin XU Aibin YAN Zhengfeng HUANG 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2017/12/01
Vol. E100-C  No. 12 ; pp. 1108-1117
Type of Manuscript:  PAPER
Category: Integrated Electronics
Keyword: 
3D ICs, yield enhancement, TSV redundancy, reparability, additional delay overhead, 
 Summary | Full Text:PDF