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IEICE Trans

Keyword : TEGs

Through-Silicon-Via Characterization and Modeling Using a Novel One-Port De-Embedding Technique
An-Sam PENG Ming-Hsiang CHO Yueh-Hua WANG Meng-Fang WANG David CHEN Lin-Kun WU 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2013/10/01
Vol. E96-C  No. 10 ; pp. 1289-1293
Type of Manuscript:  Special Section PAPER (Special Section on Emerging Technologies and Applications for Microwave and Millimeter-Wave Systems)
Category: 
Keyword: 
3D IC, TSV, de-embedding, TEGs, microwave, RF modeling, 
 Summary | Full Text:PDF