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| Keyword : RF-IC
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High Density Front-End Technologies for RF ATE with Multiple Resources and High Throughput Testing
Masayuki KIMISHIMA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2026/10/01
Vol. E109-C
No. 10 ;
pp. 382-389
Type of Manuscript:
INVITED PAPER (Special Section on Microwave and Millimeter-Wave Technologies)
Category:
Keyword:
RF test, ATE, SIP, RF-IC, LTCC, ΔΣ modulator, MMIC, | | | Summary | Full Text:PDF | |
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The Dawn of the New RF-HySIC Semiconductor Integrated Circuits: An Initiative for Hybrid ICs Consisting of Si and Compound Semiconductors
Shigeo KAWASAKI Akihira MIYACHI | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2016/10/01
Vol. E99-C
No. 10 ;
pp. 1085-1093
Type of Manuscript:
INVITED PAPER (Special Section on Microwave and Millimeter-Wave Technology)
Category:
Keyword:
hybrid semiconductor IC, RF-IC, GaN amplifier, rectifier, | | | Summary | Full Text:PDF | |
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