Cooling Characteristics of Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed Telecommunication Systems Tohru KISHIMOTOYasuo KANEKO
Publication: IEICE TRANSACTIONS on Communications Publication Date: 1998/02/25 Vol. E81-BNo. 2 ;
pp. 466-472 Type of Manuscript: Special Section PAPER (Special Issue on ATM Switching Systems for future B-ISDN) Category: Advanced technologies for ATM system Keyword: ATM switching system, LU, emulation, FPGA, interconnect device,