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IEICE Trans

Keyword : 3D memory

Crosstalk Analysis and Countermeasures of High-Bandwidth 3D-Stacked Memory Using Multi-Hop Inductive Coupling Interface
Kota SHIBA Atsutake KOSUGE Mototsugu HAMADA Tadahiro KURODA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2023/07/01
Vol. E106-C  No. 7 ; pp. 391-394
Type of Manuscript:  BRIEF PAPER
Category: 
Keyword: 
3D integration, 3D memory, 8-shaped coil, inductive coupling, through-silicon via (TSV), ThruChip Interface, 
 Summary | Full Text:PDF