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IEICE Trans

Keyword : planar packaging

Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed, High-Density Switching Systems
Tohru KISHIMOTO Keiichi YASUNA Hiroki OKA Katsumi KAIZU Sinichi SASAKI Yasuo KANEKO 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 1998/10/25
Vol. E81-B  No. 10 ; pp. 1894-1902
Type of Manuscript:  PAPER
Category: Communication Systems and Transmission Equipment
Keyword: 
planar packaging, card-on-board packaging, multichip module, coaxial ZIF connector, ATM switching system, 
 Summary | Full Text:PDF