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IEICE Trans

Keyword : via density

Redundant via Insertion: Removing Design Rule Conflicts and Balancing via Density
Song CHEN Jianwei SHEN Wei GUO Mei-Fang CHIANG Takeshi YOSHIMURA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2010/12/01
Vol. E93-A  No. 12 ; pp. 2372-2379
Type of Manuscript:  Special Section PAPER (Special Section on VLSI Design and CAD Algorithms)
Category: Physical Level Design
Keyword: 
redundant via, double via, design for manufacturability, via density, 
 Summary | Full Text:PDF