Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2009/04/01
Vol. E92-A
No. 4 ;
pp. 1080-1087
Type of Manuscript:
Special Section PAPER (Special Section on Advanced Technologies Emerging Mainly from the 21st Workshop on Circuits and Systems in Karuizawa)
Category:
Keyword:
three dimensional integrated circuits, through-the-silicon via, via assignment, |