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IEICE Trans

Keyword : temperature increase

Temperature-Aware Layer Assignment for Three-Dimensional Integrated Circuits
Shih-Hsu HUANG Hua-Hsin YEH 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2014/08/01
Vol. E97-A  No. 8 ; pp. 1699-1708
Type of Manuscript:  PAPER
Category: VLSI Design Technology and CAD
Keyword: 
electronic design automation, high-level design stage, design partitioning, layer assignment, three-dimensional integrated circuits, temperature increase, 
 Summary | Full Text:PDF