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IEICE Trans

Keyword : multi commodity flow

An Efficient Multi-Level Algorithm for 3D-IC TSV Assignment
Cong HAO Takeshi YOSHIMURA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2017/03/01
Vol. E100-A  No. 3 ; pp. 776-784
Type of Manuscript:  PAPER
Category: VLSI Design Technology and CAD
Keyword: 
3D-IC, TSV assignment, multi commodity flow, 
 Summary | Full Text:PDF