A Combination Method for Impedance Extraction of SMD Electronic Components Based on Full-Wave Simulation and De-Embedding Technique Yang XIAOZhongyuan ZHOUMingjie SHENGQi ZHOU
Publication: IEICE TRANSACTIONS on Electronics Publication Date: 1994/10/25 Vol. E77-CNo. 10 ;
pp. 1575-1580 Type of Manuscript: Special Section PAPER (Special Issue on Recent Electromechanical Devices) Category: Connectors: Optical and Conventional Keyword: quasi-coaxial, surface mount technology, SMD, connector, multichip module,