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An Efficient Multi-Level Algorithm for 3D-IC TSV Assignment
Cong HAO Takeshi YOSHIMURA | Publication: IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2017/03/01
Vol. E100-A
No. 3 ;
pp. 776-784
Type of Manuscript:
PAPER
Category: VLSI Design Technology and CAD
Keyword:
3D-IC, TSV assignment, multi commodity flow, | | | Summary | Full Text:PDF | |
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