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IEICE Trans

Yuta UEDA

High-Frequency and Integrated Design Based on Flip-Chip Interconnection Technique (Hi-FIT) for High-Speed (>100 Gbaud) Optical Devices
Shigeru KANAZAWA Hiroshi YAMAZAKI Yuta UEDA Wataru KOBAYASHI Yoshihiro OGISO Johsuke OZAKI Takahiko SHINDO Satoshi TSUNASHIMA Hiromasa TANOBE Atsushi ARARATAKE 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2019/04/01
Vol. E102-C  No. 4  pp. 340-346
Type of Manuscript:  INVITED PAPER (Special Section on Progress in Optical Device Technology for Increasing Data Transmission Capacity)
Category: 
Keyword: 
flip-chip, EA-DFB laser, Mach-Zehnder modulator, packaging, 
 Summary | Full Text:PDF