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IEICE Trans

Yoshihiro BESSHO

An Application of a Flip-Chip-Bonding Technique to GHz-Band SAW Filter for Mobile Communication
Keiji ONISHI Shun-ichi SEKI Yutaka TAGUCHI Yoshihiro BESSHO Kazuo EDA Toru ISHIDA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1993/06/25
Vol. E76-C  No. 6  pp. 993-999
Type of Manuscript:  Special Section PAPER (Special Issue on Microwave and Millimeter-Wave Technology for Advanced Functions and Size-Reductions)
Category: 
Keyword: 
SAW, filter, microwave, flip-chip-bonding, stud-bump-bonding, 
 Summary | Full Text:PDF