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IEICE Trans

Wataru TAMAMURA

Automatic LSI Package Lead Inspection System with CCD Camera for Backside Lead Specification
Wataru TAMAMURA Koji NAKAMAE Hiromu FUJIOKA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2003/04/01
Vol. E86-C  No. 4  pp. 661-667
Type of Manuscript:  PAPER
Category: Integrated Electronics
Keyword: 
backside LSI package lead inspection system, image processing, QFP package, line-scan CCD camera, 
 Summary | Full Text:PDF