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IEICE Trans

Tzong-Lin WU

Mitigation of Noise Coupling in Multilayer High-Speed PCB: State of the Art Modeling Methodology and EBG Technology
Tzong-Lin WU Jun FAN Francesco de PAULIS Chuen-De WANG Antonio Ciccomancini SCOGNA Antonio ORLANDI 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 2010/07/01
Vol. E93-B  No. 7  pp. 1678-1689
Type of Manuscript:  INVITED PAPER (Special Section on Advanced Electromagnetic Compatibility Technology in Conjunction with Main Topics of EMC'09/Kyoto)
Category: 
Keyword: 
multilayer high-speed PCB modeling, PDN, ground bounce noise, EBG, PCPL, GSPL, 
 Summary | Full Text:PDF