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IEICE Trans

Toyoko KOYAMA

Microwave-Circuit-Embedded Resin Printed Circuit Board for Short Range Wireless Interfaces
Akira SAITOU Kazuhiko HONJO Kenichi SATO Toyoko KOYAMA Koichi WATANABE 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2005/01/01
Vol. E88-C  No. 1  pp. 83-88
Type of Manuscript:  Special Section PAPER (Special Section on Recent Trends of Microwave and Millimeter-Wave Passive Circuit Components and Technologies for Improvement of Characteristics)
Category: 
Keyword: 
microwave, resin, PCB, balun, BPF, loss, integration, 
 Summary | Full Text:PDF