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Present and Future Directions for Multichip Module Technologies
Toshio SUDO | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1995/06/25
Vol. E78-C
No. 6
pp. 684-690
Type of Manuscript:
Special Section PAPER (Special Issue on the 1994 VLSI Circuits Symposium (Joint Issue with the IEEE Journal of Solid-State Circuits, Vol. 30, No. 4 April 1995))
Category:
Keyword:
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A Silicon-Based Multichip Module with Co-Fired Aluminum Nitride Package
Toshio SUDO Susumu KIMIJIMA Osamu SHIMADA Nobuo IWASE | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1991/08/25
Vol. E74-C
No. 8
pp. 2323-2330
Type of Manuscript:
Special Section PAPER (Special Issue on Advanced Packaging Technology for Microelectronics Manufacturing)
Category: Multi Chip Module
Keyword:
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