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IEICE Trans

Toshimitsu YAMASHITA

Development of Ultra Fine Wire and Fine Pitch Bonding Technology
Toshimitsu YAMASHITA Takashi KANAMORI Yasuo IGUCHI Yoshinori ARAO Susumu SHIBATA Yasuhide OHNO Yoshio OHZEKI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1991/08/25
Vol. E74-C  No. 8  pp. 2369-2377
Type of Manuscript:  Special Section PAPER (Special Issue on Advanced Packaging Technology for Microelectronics Manufacturing)
Category: Manufacturing Technology
Keyword: 
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