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IEICE Trans

Tomoaki SAKAI

An Analysis of and a Method of Enhancing the Intensity of OBIRCH Signal for Defects Observation in VLSI Metal Interconnections
Naoki KAWAMURA Tomoaki SAKAI Masakazu SHIMAYA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1994/04/25
Vol. E77-C  No. 4  pp. 579-584
Type of Manuscript:  Special Section PAPER (Special Issue on LSI Failure Analysis)
Category: 
Keyword: 
OBIRCH, VLSI interconnection, failure analysis, defect observation, laser scanning microscope, OBIC, 
 Summary | Full Text:PDF