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Thin Package of LSI by Transferred Bump TAB Technology Tetsuo KAWAKITA Kenzo HATADA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1991/08/25
Vol. E74-C
No. 8
pp. 2349-2354
Type of Manuscript:
Special Section PAPER (Special Issue on Advanced Packaging Technology for Microelectronics Manufacturing) Category: Interconnection Keyword:
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