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IEICE Trans

Takahisa YAMAHA

Via Electromigration Characteristics in Aluminum Based Multilevel Interconnection
Takahisa YAMAHA Masaru NAITO Tadahiko HOTTA 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 1994/01/25
Vol. E77-A  No. 1  pp. 187-194
Type of Manuscript:  Special Section PAPER (Special Section on Reliability)
Category: Failure Physics and Failure Analysis
Keyword: 
reliability, electromigration, metallization, via contact, multilevel interconnection, laminated interconnections, aluminum, 
 Summary | Full Text:PDF