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IEICE Trans

Shu YUAN

3D Inspection on Wafer Solder Bumps Using Binary Grating Projection in Integrated Circuit Manufacturing
Shu YUAN Dongping TIAN Yanxing ZENG 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2006/05/01
Vol. E89-C  No. 5  pp. 602-607
Type of Manuscript:  Special Section PAPER (Special Section on Fundamental and Application of Advanced Semiconductor Devices)
Category: Si Devices and Processes
Keyword: 
machine vision, structured light ranging, wave-front aberration correction, 
 Summary | Full Text:PDF