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IEICE Trans

Nobuo IWASE

A Silicon-Based Multichip Module with Co-Fired Aluminum Nitride Package
Toshio SUDO Susumu KIMIJIMA Osamu SHIMADA Nobuo IWASE 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1991/08/25
Vol. E74-C  No. 8  pp. 2323-2330
Type of Manuscript:  Special Section PAPER (Special Issue on Advanced Packaging Technology for Microelectronics Manufacturing)
Category: Multi Chip Module
Keyword: 
 Summary | Full Text:PDF