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IEICE Trans

Nobuhiro SHIMOYAMA

The Influence of Stud Bumping above the MOSFETs on Device Reliability
Nobuhiro SHIMOYAMA Katsuyuki MACHIDA Masakazu SHIMAYA Hideo AKIYA Hakaru KYURAGI 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2000/05/25
Vol. E83-A  No. 5  pp. 851-856
Type of Manuscript:  Special Section PAPER (Special Section on Reliability Theory and Its Applications)
Category: 
Keyword: 
stud bump, stress, interface traps, hot carrier, annealing, 
 Summary | Full Text:PDF