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IEICE Trans

Naohiro UEDA

Post-Packaging Simulation Based on MOSFET Characteristics Variations Due to Resin-Molded Encapsulation
Naohiro UEDA Hirobumi WATANABE 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2020/06/01
Vol. E103-C  No. 6  pp. 317-323
Type of Manuscript:  PAPER
Category: Ultrasonic Electronics
Keyword: 
stress, piezoelectric, package, simulation, SPICE, 
 Summary | Full Text:PDF