Publication: IEICE TRANSACTIONS on Communications
Publication Date: 2010/07/01
Vol. E93-B
No. 7
pp. 1723-1730
Type of Manuscript:
Special Section PAPER (Special Section on Advanced Electromagnetic Compatibility Technology in Conjunction with Main Topics of EMC'09/Kyoto) Category: Chip and Package Level EMC Keyword: immunity, integrated circuit, EMC model, ICIM, black-box modeling, spice, |