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IEICE Trans

Masatake NAKANO

Contribution of Polished Surface Waviness to Final SOI Thickness Uniformity of Bonded Wafers through PACE Process
Kiyoshi MITANI Masatake NAKANO Takao ABE 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1997/03/25
Vol. E80-C  No. 3  pp. 370-377
Type of Manuscript:  INVITED PAPER (Special Issue on SOI Devices and Their Process Technologies)
Category: Wafer Technologies
Keyword: 
surface waviness, PACE, SOI thickness uniformity, polishing, PSD, 
 Summary | Full Text:PDF