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IEICE Trans

Masahide HARADA

LSI Packaging Technology for Mainframe Computers
Kenji TAKEDA Masahide HARADA Tsuyoshi FUJITA Takashi INOUE 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1991/08/25
Vol. E74-C  No. 8  pp. 2337-2343
Type of Manuscript:  Special Section PAPER (Special Issue on Advanced Packaging Technology for Microelectronics Manufacturing)
Category: Packaging Technology for Main Frame
Keyword: 
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