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IEICE Trans

Jyh-Perng FANG

Layer-Aware 3D-IC Partitioning for Area-Overhead Reduction Considering the Power of Interconnections and Pads
Yung-Hao LAI Yang-Lang CHANG Jyh-Perng FANG Lena CHANG Hirokazu KOBAYASHI 
Publication:   IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences
Publication Date: 2016/06/01
Vol. E99-A  No. 6  pp. 1206-1215
Type of Manuscript:  PAPER
Category: VLSI Design Technology and CAD
Keyword: 
3D-IC, TSV, partitioning, area-overhead reduction, power consumption, 
 Summary | Full Text:PDF