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IEICE Trans

Junho LEE

Microwave Frequency Model of FPBGA Solder Ball Extracted from S-Parameters Measurement
Junho LEE Seungyoung AHN Woon-Seong KWON Kyung-Wook PAIK Joungho KIM 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2004/09/01
Vol. E87-C  No. 9  pp. 1621-1627
Type of Manuscript:  PAPER
Category: Electronic Components
Keyword: 
ball grid array, fine pitched BGA, lumped circuit model, microwave frequency, S-parameters, 
 Summary | Full Text:PDF