Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1997/03/25
Vol. E80-C
No. 3
pp. 378-387
Type of Manuscript:
INVITED PAPER (Special Issue on SOI Devices and Their Process Technologies) Category: Wafer Technologies Keyword: porous, BESOI, pre-injection, structure-sensitive etching, hydrogen annealing, edge exclusion, batch process, |