Publication: IEICE TRANSACTIONS on Communications
Publication Date: 2005/08/01
Vol. E88-B
No. 8
pp. 3121-3126
Type of Manuscript:
INVITED PAPER (Special Section of 2004 International Symposium on Electromagnetic Compatibility) Category: Keyword: signal integrity, electromagnetic compatibility, macromodeling, digital integrated circuits, transmission lines, 3D interconnects, passivity, |