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IEICE Trans

Hidetoshi ISHIDA

A Compact Plastic Package with High RF Isolation by Subsidiary Inner Ground Leads
Hidetoshi ISHIDA Kazuo MIYATSUJI Tsuyoshi TANAKA Daisuke UEDA Chihiro HAMAGUCHI 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1999/11/25
Vol. E82-C  No. 11  pp. 2044-2049
Type of Manuscript:  Special Section PAPER (Special Issue on High-Frequency/High-Speed Devices for Information and Communication Systems in the 21st Century)
Category: RF Assembly Technology
Keyword: 
package, subsidiary ground, high isolation, electromagnetic simulation, 
 Summary | Full Text:PDF