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IEICE Trans

Chai-Mei PENG

Analysis of Radiated Emission in Multi-Microstrip Lines above Finite Size Ground Plane
I-Fong CHEN Chai-Mei PENG Ching-Wen HSUE 
Publication:   IEICE TRANSACTIONS on Communications
Publication Date: 2005/04/01
Vol. E88-B  No. 4  pp. 1748-1752
Type of Manuscript:  LETTER
Category: Energy in Electronics Communications
Keyword: 
radiated emissions, imperfect ground, multi-microstrip lines, TMLs, EMI, 
 Summary | Full Text:PDF