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IEICE Trans

Bernard ASPAR

SMART-CUT(R): The Basic Fabrication Process for UNIBOND(R) SOI Wafers
A.J. AUBERTON-HERVE Michel BRUEL Bernard ASPAR Christophe MALEVILLE Hubert MORICEAU 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 1997/03/25
Vol. E80-C  No. 3  pp. 358-363
Type of Manuscript:  INVITED PAPER (Special Issue on SOI Devices and Their Process Technologies)
Category: Wafer Technologies
Keyword: 
SOI, UNIBOND(R), Smart-Cut(R), wafer bonding, 
 Summary | Full Text:PDF