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IEICE Trans

Belinda PIERNAS

Three-Dimensional MMIC Technology on Silicon: Review and Recent Advances
Belinda PIERNAS Kenjiro NISHIKAWA Kenji KAMOGAWA Ichihiko TOYODA 
Publication:   IEICE TRANSACTIONS on Electronics
Publication Date: 2002/07/01
Vol. E85-C  No. 7  pp. 1394-1403
Type of Manuscript:  INVITED PAPER (Special Issue on Silicon RF Device & Integrated Circuit Technologies)
Category: 
Keyword: 
three-dimensional, MMIC, silicon, masterslice, single-chip transceiver, 
 Summary | Full Text:PDF