Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2005/08/01
Vol. E88-C
No. 8
pp. 1620-1628
Type of Manuscript:
Special Section PAPER (Special Section on Recent Development of Electro-Mechanical Devices--Selected Papers from International Session on Electro-Mechanical Devices 2004 (IS-EMD2004)--) Category: Relays and Switches Keyword: electromechanical devices, telecom- and signal relays, lead free soldering, reliability, mixed assemblies, |