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| Akihiro DOHYA
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Packaging Technology Trends and Challenges for System-in-Package
Akihiro DOHYA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 2001/12/01
Vol. E84-C
No. 12
pp. 1756-1762
Type of Manuscript:
INVITED PAPER (Special Issue on Integrated Systems with New Concepts)
Category:
Keyword:
packaging technology, system-in-package, SIP, SoC, CSP, | | | Summary | Full Text:PDF | |
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High Performance Packaging Technology for Supercomputers
Toshihiko WATARI Akihiro DOHYA | Publication: IEICE TRANSACTIONS on Electronics
Publication Date: 1991/08/25
Vol. E74-C
No. 8
pp. 2331-2336
Type of Manuscript:
Special Section PAPER (Special Issue on Advanced Packaging Technology for Microelectronics Manufacturing)
Category: Packaging Technology for Main Frame
Keyword:
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