Highly Reliable Silica-LiNbO3 Hybrid Modulator Using Heterogeneous Material Integration Technology

Atsushi ARATAKE  Ken TSUZUKI  Motohaya ISHII  Takashi SAIDA  Takashi GOH  Yoshiyuki DOI  Hiroshi YAMAZAKI  Takao FUKUMITSU  Takashi YAMADA  Shinji MINO  

Publication:   IEICE TRANSACTIONS on Electronics
Publicized: 2020/02/13
DOI: 10.1587/transele.2019ECP5044
Full Text: PDF(1.4MB)