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Analysis and Evaluation of Electromagnetic Interference between ThruChip Interface and LC-VCO
IEICE TRANSACTIONS on Electronics
Publication Date: 2016/06/01
Online ISSN: 1745-1353
Type of Manuscript: BRIEF PAPER
TCI, 3D integration, LC-VCO, EMI,
Full Text: PDF(1.7MB)>>
This paper presents analysis and simple design guideline for ThruChip Interface (TCI) as located by LC-VCO which is used in high-speed SoC. The electromagnetic interference (EMI) from TCI channels to LC-VCO is analyzed and evaluated. The accuracy of the analysis and design guidelines is verified through the test-chip verification.