Analysis and Evaluation of Electromagnetic Interference between ThruChip Interface and LC-VCO

Junichiro KADOMOTO  So HASEGAWA  Yusuke KIUCHI  Atsutake KOSUGE  Tadahiro KURODA  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E99-C   No.6   pp.659-662
Publication Date: 2016/06/01
Online ISSN: 1745-1353
DOI: 10.1587/transele.E99.C.659
Type of Manuscript: BRIEF PAPER
Category: 
Keyword: 
TCI,  3D integration,  LC-VCO,  EMI,  

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Summary: 
This paper presents analysis and simple design guideline for ThruChip Interface (TCI) as located by LC-VCO which is used in high-speed SoC. The electromagnetic interference (EMI) from TCI channels to LC-VCO is analyzed and evaluated. The accuracy of the analysis and design guidelines is verified through the test-chip verification.