Integrated Photonic Devices and Applications for 100GbE-and-Beyond Datacom

Yoshiyuki DOI
Takaharu OHYAMA
Toshihide YOSHIMATSU
Tetsuichiro OHNO
Yasuhiko NAKANISHI
Shunichi SOMA
Hiroshi YAMAZAKI
Manabu OGUMA
Toshikazu HASHIMOTO
Hiroaki SANJOH

Publication
IEICE TRANSACTIONS on Electronics   Vol.E99-C    No.2    pp.157-164
Publication Date: 2016/02/01
Online ISSN: 1745-1353
DOI: 10.1587/transele.E99.C.157
Type of Manuscript: Special Section INVITED PAPER (Special Section on Recent Advances in Photonics Technologies and Their Applications)
Category: 
Keyword: 
integrated photonics,  datacom,  100GbE/400GbE,  optical sub-assembly,  arrayed waveguide grating,  

Full Text: FreePDF

Summary: 
We review recent progress in integrated photonics devices and their applications for datacom. In addition to current technology used in 100-Gigabit Ethernet (100GbE) with a compact form-factor of the transceiver, the next generation of technology for 400GbE seeks a larger number of wavelengths with a more sophisticated modulation format and higher bit rate per wavelength. For wavelength scalability and functionality, planar lightwave circuits (PLCs), such as arrayed waveguide gratings (AWGs), will be important, as well higher-order-modulation to ramp up the total bit rate per wavelength. We introduce integration technology for a 100GbE optical sub-assembly that has a 4λ x 25-Gb/s non-return-to-zero (NRZ) modulation format. For beyond 100GbE, we also discuss applications of 100GbE sub-assemblies that provide 400-Gb/s throughput with 16λ x 25-Gb/s NRZ and bidirectional 8λ x 50-Gb/s four-level pulse amplitude modulation (PAM4) using PLC cyclic AWGs.