Integrated Photonic Devices and Applications for 100GbE-and-Beyond Datacom

Yoshiyuki DOI  Takaharu OHYAMA  Toshihide YOSHIMATSU  Tetsuichiro OHNO  Yasuhiko NAKANISHI  Shunichi SOMA  Hiroshi YAMAZAKI  Manabu OGUMA  Toshikazu HASHIMOTO  Hiroaki SANJOH  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E99-C   No.2   pp.157-164
Publication Date: 2016/02/01
Online ISSN: 1745-1353
DOI: 10.1587/transele.E99.C.157
Type of Manuscript: INVITED PAPER (Special Section on Recent Advances in Photonics Technologies and Their Applications)
Category: 
Keyword: 
integrated photonics,  datacom,  100GbE/400GbE,  optical sub-assembly,  arrayed waveguide grating,  

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Summary: 
We review recent progress in integrated photonics devices and their applications for datacom. In addition to current technology used in 100-Gigabit Ethernet (100GbE) with a compact form-factor of the transceiver, the next generation of technology for 400GbE seeks a larger number of wavelengths with a more sophisticated modulation format and higher bit rate per wavelength. For wavelength scalability and functionality, planar lightwave circuits (PLCs), such as arrayed waveguide gratings (AWGs), will be important, as well higher-order-modulation to ramp up the total bit rate per wavelength. We introduce integration technology for a 100GbE optical sub-assembly that has a 4λ x 25-Gb/s non-return-to-zero (NRZ) modulation format. For beyond 100GbE, we also discuss applications of 100GbE sub-assemblies that provide 400-Gb/s throughput with 16λ x 25-Gb/s NRZ and bidirectional 8λ x 50-Gb/s four-level pulse amplitude modulation (PAM4) using PLC cyclic AWGs.