Preliminary Study of Electrical Contact Behaviors of Au-plated Material at Super Low Making/Breaking Velocity

Wanbin REN  Shengjun XUE  Hongxu ZHI  Guofu ZHAI  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E98-C   No.4   pp.364-370
Publication Date: 2015/04/01
Online ISSN: 1745-1353
DOI: 10.1587/transele.E98.C.364
Type of Manuscript: PAPER
Category: Electromechanical Devices and Components
Keyword: 
electrical contact,  Au-plated material,  contact voltage,  adhesion force,  super low velocity,  

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Summary: 
This paper presents the electrical contact behaviors of Au-plated material at super low making and breaking velocity conditions by introducing our new designed test rig. The fundamental phenomena in the contact voltage and contact force versus piezoactuator displacement curves were investigated under the load current of 1A and velocity of 50 nm/s. From the repetitive experimental results, we found that the adhesion phenomena during the unloading process are closely correlative with the initial contact stage in the loading process. Furthermore, a mathematical model which is relative to the variation of contact force in loading is built, thus the physical mechanism of adhesion and principal factors of gold-plated materials are discussed. Finally, the physical process of molten bridge under the no mechanical contact situation is also analyzed in detail.