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120-GHz-Band Amplifier Module with Hermetic Sealing Structure for 10-Gbit/s Wireless System
Hiroyuki TAKAHASHI Toshihiko KOSUGI Akihiko HIRATA Jun TAKEUCHI Koichi MURATA Naoya KUKUTSU
IEICE TRANSACTIONS on Electronics
Publication Date: 2014/06/01
Online ISSN: 1745-1353
Type of Manuscript: PAPER
Category: Electronic Components
millimeter-wave, waveguide, connection technique, wireless communication,
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This paper presents a 120-GHz-band amplifier module with a hermetic sealing structure for a broadband wireless system. The sealing structure for F-band waveguides is a laminate composed of two sealing plates and a spacer. Each sealing plate has a fused glass window and separates inside air from the ambient atmosphere. The design process of the sealing structure is simple and has good simulation fidelity. The hermetic sealing structure designed for an amplifier in a 120-GHz-band wireless link has an insertion loss of less than 1dB and a return loss of more than 15dB in the operating band. We made three kinds of sealed modules to evaluate the sealing function. The modules sealed with this technique meet the hermetic-seal standard in MIL-STD-883F. We then verified that the sealing structure on the sealed modules has a small enough effect for the transmittance of the intrinsic characteristics. In addition, we performed 10-Gbit/s data transmission using a sealed amplifier module with the bit error rate of less than 10-10.