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AC Power Supply Noise Simulation of CMOS Microprocessor with LSI Chip-Package-Board Integrated Model
Kumpei YOSHIKAWA Kouji ICHIKAWA Makoto NAGATA
IEICE TRANSACTIONS on Electronics
Publication Date: 2014/04/01
Online ISSN: 1745-1353
Type of Manuscript: Special Section PAPER (Special Section on Solid-State Circuit Design,---,Architecture, Circuit, Device and Design Methodology)
power supply noise, electromagnetic compatibility, LSI chip-package-board co-design, power integrity,
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An LSI Chip-Package-Board integrated power noise simulation model and its validity is discussed in this paper. A unified power delivery network (PDN) of LSI chip, package, and printed circuit board (PCB) is connected with on-chip power supply current models with capacitor charging expression. The proposed modeling flow is demonstrated for the 32-bit microprocessor in a 1.0V 90nm CMOS technology. The PDN of the system that includes a chip, bonding wires and a printed circuit board is modeled in an equivalent circuit. The on-chip power supply noise monitoring technique and the magnetic probe method is applied for validating simulation results. Simulations and measurements explore power supply noise generation with the dependency on operating frequencies in the wide range from 10MHz to 300MHz, under the operation mode of dynamic frequency scaling, and in the long time operation with various operation codes. It is confirmed that the proposed power supply noise simulation model is helpful for the noise estimation throughout the design phase of the LSI system.