Advances in High-Density Inter-Chip Interconnects with Photonic Wiring

Yutaka URINO  Yoshiji NOGUCHI  Nobuaki HATORI  Masashige ISHIZAKA  Tatsuya USUKI  Junichi FUJIKATA  Koji YAMADA  Tsuyoshi HORIKAWA  Takahiro NAKAMURA  Yasuhiko ARAKAWA  

IEICE TRANSACTIONS on Electronics   Vol.E96-C    No.7    pp.958-965
Publication Date: 2013/07/01
Online ISSN: 1745-1353
DOI: 10.1587/transele.E96.C.958
Print ISSN: 0916-8516
Type of Manuscript: Special Section INVITED PAPER (Special Section on Recent Advances in Integrated Photonic Devices)
integrated optics,  integrated optoelectronics,  optical devices,  optical interconnections,  

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One of the most serious challenges facing the exponential performance growth in the information industry is a bandwidth bottleneck in inter-chip interconnects. We therefore propose a photonics-electronics convergence system with a silicon optical interposer. We examined integration between photonics and electronics and integration between light sources and silicon substrates, and we fabricated a conceptual model of the proposed system based on the results of those examinations. We also investigated the configurations and characteristics of optical components for the silicon optical interposer: silicon optical waveguides, silicon optical splitters, silicon optical modulators, germanium photodetectors, arrayed laser diodes, and spot-size converters. We then demonstrated the feasibility of the system by fabricating a high-density optical interposer by using silicon photonics integrated with these optical components on a single silicon substrate. As a result, we achieved error-free data transmission at 12.5 Gbps and a high bandwidth density of 6.6 Tbps/cm2 with the optical interposer. We think that this technology will solve the bandwidth bottleneck problem.