Integrated Photonic Platforms for Telecommunications: InP and Si

Christopher R. DOERR  

Publication
IEICE TRANSACTIONS on Electronics   Vol.E96-C   No.7   pp.950-957
Publication Date: 2013/07/01
Online ISSN: 1745-1353
DOI: 10.1587/transele.E96.C.950
Print ISSN: 0916-8516
Type of Manuscript: INVITED PAPER (Special Section on Recent Advances in Integrated Photonic Devices)
Category: 
Keyword: 
advanced modulation formats,  coherent,  fiber optic communication,  gratings,  indium phosphide,  photonic integrated circuits,  silicon photonics,  

Full Text: FreePDF(8.1MB)


Summary: 
There is a relentless push for cost and size reduction in optical transmitters and receivers for fiber-optic links. Monolithically integrated optical chips in InP and Si may be a way to leap ahead of this trend. We discuss uses of integration technology to accomplish various telecommunications functions.