A Thermal-Aware High-Level Synthesis Algorithm for RDR Architectures through Binding and Allocation


IEICE TRANSACTIONS on Fundamentals of Electronics, Communications and Computer Sciences   Vol.E96-A   No.1   pp.312-321
Publication Date: 2013/01/01
Online ISSN: 1745-1337
DOI: 10.1587/transfun.E96.A.312
Print ISSN: 0916-8508
Type of Manuscript: PAPER
Category: VLSI Design Technology and CAD
high-level synthesis,  RDR,  thermal-aware,  hot spots,  interconnect delays,  

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With process technology scaling, a heat problem in ICs is becoming a serious issue. Since high temperature adversely impacts on reliability, design costs, and leakage power, it is necessary to incorporate thermal-aware synthesis into IC design flows. In particular, hot spots are serious concerns where a chip is locally too much heated and reducing the peak temperature inside a chip is very important. On the other hand, increasing the average interconnect delays is also becoming a serious issue. By using RDR architectures (Regular-Distributed-Register architectures), the interconnect delays can be easily estimated and their influence can be much reduced even in high-level synthesis. In this paper, we propose a thermal-aware high-level synthesis algorithm for RDR architectures. The RDR architecture divides the entire chip into islands and each island has uniform area. Our algorithm balances the energy consumption among islands through re-binding to functional units. By allocating some new additional functional units to vacant areas on islands, our algorithm further balances the energy consumption among islands and thus reduces the peak temperature. Experimental results demonstrate that our algorithm reduces the peak temperature by up to 9.1% compared with the conventional approach.