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A 60 GHz-Band 3-Dimensional System-in-Package Transmitter Module with Integrated Antenna
Noriharu SUEMATSU Satoshi YOSHIDA Shoichi TANIFUJI Suguru KAMEDA Tadashi TAKAGI Kazuo TSUBOUCHI
IEICE TRANSACTIONS on Electronics
Publication Date: 2012/07/01
Online ISSN: 1745-1353
Print ISSN: 0916-8516
Type of Manuscript: INVITED PAPER (Special Section on Recent Trends of Microwave Systems and Their Fundamental Technologies)
module, RFIC, MMIC, antenna integration, millimeter-wave, SiP, stud bump,
Full Text: FreePDF(6.8MB)
A low cost, ultra small Radio Frequency (RF) transceiver module with integrated antenna is one of the key technologies for short range millimeter-wave wireless communication. This paper describes a 60 GHz-band transmitter module with integrated dipole antenna. The module consists of three pieces of low-cost organic resin substrate. These substrates are vertically stacked by employing Cu ball bonding 3-dimensional (3-D) system-in-package (SiP) technology and the MMIC's are mounted on each organic substrates by using Au-stud bump bonding (SBB) technique. The planer dipole antenna is fabricated on the top of the stacked organic substrate to avoid the influence of the grounding metal on the base substrate. At 63 GHz, maximum actual gain of 6.0 dBi is obtained for fabricated planar dipole antenna. The measured radiation patterns are agreed with the electro-magnetic (EM) simulated result, therefore the other RF portion of the 3-D front-end module, such as flip chip mounted IC's on the top surface of the module, does not affect the antenna characteristics. The results show the feasibility of millimeter-wave low cost, ultra small antenna integrated module using stacked organic substrates.